HONG KONG – (ACN Newswire) – Hua Hong Semiconductor Limited (“Hua Hong Semiconductor” or the “Company”, stock code: 1347.HK), a global leading specialty foundry, today announced the Company’s total shipments of financial card ICs hit another new high, with a year-on-year increase of more than 200% in 2017. Furthermore, the shipment of smart card ICs with a payment function, such as pure financial IC cards, social security cards and resident health cards, reached circa 430 million.
A review on the financial IC card industry in 2017 shows that, as domestically-produced chips accelerated its entery into the market, the market share of domestic suppliers has been rapidly growing. At the same time, there is also a gradually increasing demand from the overseas financial IC card market. Based on its leading eNVM technology, Hua Hong Semiconductor has seized this market opportunity to proactively develop its financial IC card chip business through close cooperation with domestic and international smart card chip manufacturers.
Currently, on the basis of its proven 0.13 um and 0.11 um embedded non-volatile memory (eNVM) process technology, Hua Hong Semiconductor equips itself with technology advantage and continuously upgrades and innovates to achieve successful mass production of the 90nm eNVM featured with a more advanced size. This process has excellent stability, high reliability, low power consumption, and smaller chip size than predecessors, providing customers with technically leading and more competitive solutions. Hua Hong Semiconductor (Wuxi) Limited is currently building a 300mm IC production line with a monthly capacity of 40,000 wafers. The Company’s process will be upgraded to the technology node of 65/55 nm, and its existing advantage vested in the eNVM technology will definitely be further extended in depth, so as to provide excellent manufacturing solutions for smart cards, microcontroller units(MCUs), security chips and other products.
“The expertise of Hua Hong Semiconductor in the field of financial IC card chip is well established. With the assistance of excellent eNVM technology, lean management and quality service, we are enabled to win absolute trust from the market and customers.” Said Mr. Fan Heng, Executive Vice President of Hua Hong Semiconductor,” We will spare no effort to become a benchmark of China made chips and offer secure and reliable manufacturing solutions for financial IC card chips to power our partners in domestic and international financial industries.”
About Hua Hong Semiconductor Limited
Hua Hong Semiconductor Limited (“Hua Hong Semiconductor”, stock code: 1347.HK) is a global leading specialty foundry, focusing on eNVM, power discretes, analog and power management, and logic and RF process platforms. Its outstanding quality control system satisfies the strict requirements of automotive chip manufacturing. Hua Hong Semiconductor is part of the Huahong Group, which is an important member of China’s 909 Project. With semiconductor manufacturing as its core business, Huahong Group is a high tech, globally oriented, highly competetive enterprise with innovative capabilities.
Hua Hong Semiconductor presently operates three 200mm wafer fabrication facilities (HH Fab1, HH Fab2, HH Fab3) in Jinqiao and Zhangjiang, Shanghai, with a total capacity of approximately 170,000 wafers per month. There is also a 300mm wafer fabrication facility (HH Fab7) being built in Wuxi’s National High-Tech Industrial Development Zone, which will increase Hua Hong Semiconductor’s capacity by 40,000 wafers per month upon its completion.
For more information on the company, please visit: www.huahonggrace.com
May 8, 2018 16:26 HKT/SGT
Topic: Press release summary
Sectors: Electronics, Daily Finance, Daily News
From the Asia Corporate News Network
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